Messages in this thread | | | Date | Thu, 19 Jan 2023 18:03:07 +0100 | Subject | Re: [PATCH v7 4/4] thermal: mediatek: add another get_temp ops for thermal sensors | From | Amjad Ouled-Ameur <> |
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Hi Daniel,
On 12/29/22 16:49, Daniel Lezcano wrote: > On 06/12/2022 10:18, Amjad Ouled-Ameur wrote: >> Hi Daniel, >> On Mon Dec 5, 2022 at 8:39 PM CET, Daniel Lezcano wrote: >>> >>> Hi Amjad, >>> >>> >>> On 05/12/2022 11:41, Amjad Ouled-Ameur wrote: >>> >>> [ ... ] >>> >>>>>> @@ -1161,11 +1197,24 @@ static int mtk_thermal_probe(struct platform_device *pdev) >>>>>> platform_set_drvdata(pdev, mt); >>>>>> - tzdev = devm_thermal_of_zone_register(&pdev->dev, 0, mt, >>>>>> - &mtk_thermal_ops); >>>>>> - if (IS_ERR(tzdev)) { >>>>>> - ret = PTR_ERR(tzdev); >>>>>> - goto err_disable_clk_peri_therm; >>>>>> + for (i = 0; i < mt->conf->num_sensors + 1; i++) { >>>>>> + tz = devm_kmalloc(&pdev->dev, sizeof(*tz), GFP_KERNEL); >>>>>> + if (!tz) >>>>>> + return -ENOMEM; >>>>>> + >>>>>> + tz->mt = mt; >>>>>> + tz->id = i; >>>>>> + >>>>>> + tzdev = devm_thermal_of_zone_register(&pdev->dev, i, tz, (i == 0) ? >>>>>> + &mtk_thermal_ops : >>>>>> + &mtk_thermal_sensor_ops); >>>>> >>>>> Here you use again the aggregation >>>> I addressed this concern in V6, could you please take a look and let me >>>> know what you think [0]. >>>> >>>> [0]: https://lore.kernel.org/all/5eb0cdc2-e9f9-dd42-bf80-b7dcd8bcc196@baylibre.com/ >>> >>> May I misunderstanding but AFAICS, this patch is setting the >>> mtk_thermal_ops if the sensor id is zero. The get_temp is computing the >>> max temperature in this ops which is what we don't want to do. >> >> Correct, but I think that is out of scope of this patchset, as the current >> driver already uses mtk_thermal_ops for sensor 0. The focus of this patchset >> is to add support for the other sensors. >> >> Besides, what do you suggest as a clean implementation if the current one >> no longer meets thermal core requirements ? > > IIUC, there is a sensor per couple of cores. 1 x 2Bigs, 1 x 2Bigs, 1 x 4 Little, right ?
MT8365 SoC has 4 x A53 CPUs. The SoC has 4 thermal zones per sensor. Thermal zone 0 corresponds
to all 4 x A53 CPUs, the other thermal zones (1, 2 and 3) has nothing to do with CPUs. The cooling device type
used for CPUs is passive. FYI, thermal zones 1, 2 and 3 are present in the SoC for debug-purpose only, they are not supposed
to be used for production.
Regards,
Amjad
> > If it is the case, then a thermal zone per sensor with the trip points and a cooling device for each of them. > > The two thermal zones for the big will share the same cooling device. The little thermal zone will have its own cooling device. > > If there is the GPU, then its own cooling device also with devfreq. > > >>> <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs >>> >>> Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook | >>> <http://twitter.com/#!/linaroorg> Twitter | >>> <http://www.linaro.org/linaro-blog/> Blog >> >
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