Messages in this thread |  | | Date | Tue, 5 May 2026 09:47:21 +0200 | | From | Krzysztof Kozlowski <> | | Subject | Re: [PATCH v3] dt-bindings: thermal: qcom-tsens: Document Nord Temperature Sensor |
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On Mon, May 04, 2026 at 04:12:36PM +0800, Shawn Guo wrote: > From: Deepti Jaggi <deepti.jaggi@oss.qualcomm.com> > > Document Temperature Sensor (TSENS) on Qualcomm Nord SoC. > > Signed-off-by: Deepti Jaggi <deepti.jaggi@oss.qualcomm.com> > Reviewed-by: Pankaj Patil <pankaj.patil@oss.qualcomm.com> > Signed-off-by: Shawn Guo <shengchao.guo@oss.qualcomm.com> > --- > Changes in v3: > - Improve commit log to drop "compatible with" part > - Link to v2: https://lore.kernel.org/all/20260427012511.231475-1-shengchao.guo@oss.qualcomm.com/
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Best regards, Krzysztof
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