Messages in this thread Patch in this message |  | | From | Pinkesh Vaghela <> | | Subject | [PATCH v3 03/10] dt-bindings: vendor-prefixes: add eswin | | Date | Thu, 10 Apr 2025 20:55:12 +0530 |
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From: Pritesh Patel <pritesh.patel@einfochips.com>
Add new vendor string to dt bindings. This new vendor string is used by - ESWIN EIC770X SoC - HiFive Premier P550 board which uses EIC7700 SoC.
Link: https://www.eswin.com/en/ Signed-off-by: Pritesh Patel <pritesh.patel@einfochips.com> Reviewed-by: Samuel Holland <samuel.holland@sifive.com> Signed-off-by: Pinkesh Vaghela <pinkesh.vaghela@einfochips.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> --- Documentation/devicetree/bindings/vendor-prefixes.yaml | 2 ++ 1 file changed, 2 insertions(+)
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml index 411fd65e0bde..ce881d9c96a4 100644 --- a/Documentation/devicetree/bindings/vendor-prefixes.yaml +++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml @@ -494,6 +494,8 @@ patternProperties: description: Espressif Systems Co. Ltd. "^est,.*": description: ESTeem Wireless Modems + "^eswin,.*": + description: Beijing ESWIN Technology Group Co. Ltd. "^ettus,.*": description: NI Ettus Research "^eukrea,.*": -- 2.25.1
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