Messages in this thread | | | Date | Tue, 30 Aug 2022 11:25:51 -0500 | From | Rob Herring <> | Subject | Re: [PATCH] dt-bindings: thermal: qcom-spmi-adc-tm5: add qcom,adc-tm7 |
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On Sun, 28 Aug 2022 11:10:22 +0300, Krzysztof Kozlowski wrote: > The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the > Qualcomm PMIC Thermal Monitoring ADC. Based on downstream sources, the > new compatible for TM7 differs from older TM5 by allowing configuring > per sensor decimation, time measurement and number of sample averaging - > unlike one configuration per entire device. This was not reflected in > the bindings, therefore comment the new compatible as incomplete as it > might change and its ABI is no stable. > > Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> > --- > Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml | 1 + > 1 file changed, 1 insertion(+) >
Acked-by: Rob Herring <robh@kernel.org>
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