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SubjectRe: [PATCH v3 16/17] dt-bindings: soc: socionext: Add UniPhier DWC3 USB glue layer
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On 13/12/2022 09:24, Kunihiko Hayashi wrote:
> Add DT binding schema for components belonging to the platform-specific
> DWC3 USB glue layer implemented in UniPhier SoCs.
>
> This USB glue layer works as a sideband logic for the host controller,
> including core reset, vbus control, PHYs, and some signals to the
> controller.
>
> Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
> ---
> .../socionext,uniphier-dwc3-glue.yaml | 106 ++++++++++++++++++
> 1 file changed, 106 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml
>
> diff --git a/Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml b/Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml
> new file mode 100644
> index 000000000000..bd0def7236b5
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml
> @@ -0,0 +1,106 @@
> +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
> +%YAML 1.2


Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>

Best regards,
Krzysztof

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