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Subject[RFC PATCH v2 4/6] thermal: Add interface to cooling devices to handle governor change
Date
Add interface to cooling devices to handle governor change, to better
setup internal needed structures or to cleanup them. This interface is
going to be used by thermal governor Intelligent Power Allocation (IPA).
which requires to setup monitoring mechanism in the cpufreq cooling
devices.

Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
---
include/linux/thermal.h | 1 +
1 file changed, 1 insertion(+)

diff --git a/include/linux/thermal.h b/include/linux/thermal.h
index d296f3b88fb9..79c20daaf287 100644
--- a/include/linux/thermal.h
+++ b/include/linux/thermal.h
@@ -87,6 +87,7 @@ struct thermal_cooling_device_ops {
int (*get_requested_power)(struct thermal_cooling_device *, u32 *);
int (*state2power)(struct thermal_cooling_device *, unsigned long, u32 *);
int (*power2state)(struct thermal_cooling_device *, u32, unsigned long *);
+ int (*change_governor)(struct thermal_cooling_device *cdev, bool set);
};

struct thermal_cooling_device {
--
2.17.1
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