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SubjectRe: [PATCH v2 08/12] i2c: designware: Introduce platform drivers glue layer interface
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Hi

On 5/10/20 12:50 PM, Serge Semin wrote:
> Seeing the DW I2C platform driver is getting overcomplicated with a lot of
> vendor-specific configs let's introduce a glue-layer interface so new
> platforms which equipped with Synopsys Designware APB I2C IP-core would
> be able to handle their peculiarities in the dedicated objects.
>
Comment to this patch and patches 9/12 and 12/12:

Currently i2c-designware-platdrv.c is about 500 lines of code so I don't
think it's too overcomplicated. But I feel we have already too many
Kconfig options and source modules for i2c-designware and obviously
would like to push back a little from adding more.

I don't think i2c-designware-platdrv.c becomes yet too complicated if
Baikal related code is added there, perhaps under #ifdef CONFIG_OF like
MSCC Ocelot code is currently.

--
Jarkko

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