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Subject[PATCH v5 0/3] ADD interconnect support for Qualcomm DWC3 driver
Date
This path series aims to add interconnect support in
dwc3-qcom driver on SDM845 SoCs.

Changes from v4 -> v5
> [PATCH 1/3] Added the interconnect properties in yaml. This patch depends
on series https://patchwork.kernel.org/cover/11372641/.
> [PATCH 2/3] Fixed review comments from Matthias in DWC3 driver.
> [PATCH 3/3] Modified as per the new interconnect nodes in sdm845. Depends
on series https://patchwork.kernel.org/cover/11372211/.


Changes from v3 -> v4
> Fixed review comments from Matthias
> [PATCH 1/3] and [PATCH 3/3] remains unchanged

Changes from v2 -> v3
> Fixed review comments from Matthias and Manu
> changed the functions prefix from usb_* to dwc3_qcom_*

Changes since V1:
> Comments by Georgi Djakov on "[PATCH 2/3]" addressed
> [PATCH 1/3] and [PATCH 3/3] remains unchanged

Sandeep Maheswaram (3):
dt-bindings: usb: qcom,dwc3: Introduce interconnect properties for
Qualcomm DWC3 driver
usb: dwc3: qcom: Add interconnect support in dwc3 driver
arm64: dts: sdm845: Add interconnect properties for USB

.../devicetree/bindings/usb/qcom,dwc3.yaml | 16 +++
arch/arm64/boot/dts/qcom/sdm845.dtsi | 12 ++
drivers/usb/dwc3/dwc3-qcom.c | 135 ++++++++++++++++++++-
3 files changed, 161 insertions(+), 2 deletions(-)

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QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member
of Code Aurora Forum, hosted by The Linux Foundation

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