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Subject[PATCH 1/4] dt-bindings: thermal: Introduce monitor-falling parameter to thermal trip point binding
Date
Introduce a new binding parameter to thermal trip point description
to indicate whether the temperature level specified by the trip point
is monitored for a rise or fall in temperature.

Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
---
Documentation/devicetree/bindings/thermal/thermal.txt | 8 ++++++++
1 file changed, 8 insertions(+)

diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt
index ca14ba9..849a2a9 100644
--- a/Documentation/devicetree/bindings/thermal/thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/thermal.txt
@@ -90,6 +90,14 @@ Required properties:
"critical": Hardware not reliable.
Type: string

+Optional property:
+- monitor-falling: Indicate whether the system action is kick
+ Type: boolean started when the temperature falls below or rises
+ above the trip temperature level indicated in
+ "temperature".If true, the trip point is monitored
+ for falling temperature else the trip point is
+ monitored for rising temperature.
+
* Cooling device maps

The cooling device maps node is a node to describe how cooling devices
--
2.1.4
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