lkml.org 
[lkml]   [2019]   [May]   [15]   [last100]   RSS Feed
Views: [wrap][no wrap]   [headers]  [forward] 
 
Messages in this thread
/
Date
From
SubjectRe: [PATCH 0/19] v6 multi-die/package topology support

* Peter Zijlstra <peterz@infradead.org> wrote:

> On Mon, May 13, 2019 at 01:58:44PM -0400, Len Brown wrote:
> >
> > This patch series does 4 things.
> >
> > 1. Parse the new CPUID.1F leaf to discover multi-die/package topology
> >
> > 2. Export multi-die topology inside the kernel
> >
> > 3. Update 4 places (coretemp, pkgtemp, rapl, perf) that that need to know
> > the difference between die and package-scope MSR.
> >
> > 4. Export multi-die topology to user-space via sysfs
> >
> > These changes should have no impact on cache topology,
> > NUMA topology, Linux scheduler, or system performance.
> >
> > These topology changes primarily impact parts of the kernel
> > and some applications that care about package MSR scope.
> > Also, some software is licensed per package, and other tools,
> > such as benchmark reporting software sometimes cares about packages.
>
> I still think having a 'rapl package' be a 'die' is weird, but if that's
> the way it is specified in the SDM then so be it.
>
> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>

Thanks Peter, I'll queue it up in the next couple of days, for a
tentative v5.3 merge.

Thanks,

Ingo

\
 
 \ /
  Last update: 2019-05-15 18:38    [W:0.070 / U:3.216 seconds]
©2003-2018 Jasper Spaans|hosted at Digital Ocean and TransIP|Read the blog|Advertise on this site