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SubjectRe: [PATCH 0/14] v2 multi-die/package topology support
On Tue, 26 Feb 2019, Len Brown wrote:

> This patch series does 4 things.
>
> 1. Parses the new CPUID.1F leaf to discover multi-die/package topology
>
> 2. Export multi-die topology inside the kernel
>
> 3. Update 3 places (coretemp, pkgtemp, rapl) that that need to know
> the difference between die and package-scope MSR.
>
> (Note: Kan Liang has a patch series on top of this one to similarly
> make the uncore perf code multi-die/package aware.)
>
> 4. Export multi-die topology to user-space via sysfs

Aside of the few nitpicks (which apply to several patches) this looks very
nice.

Thanks,

tglx

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