lkml.org 
[lkml]   [2019]   [Feb]   [20]   [last100]   RSS Feed
Views: [wrap][no wrap]   [headers]  [forward] 
 
Messages in this thread
/
From
Date
SubjectRe: [PATCH 03/11] x86 topology: Add CPUID.1F multi-die/package support
On Tue, Feb 19, 2019 at 9:59 PM Like Xu <like.xu@linux.intel.com> wrote:

> > -/* leaf 0xb sub-leaf types */
> > +/* extended topology sub-leaf types */
> > #define INVALID_TYPE 0
> > #define SMT_TYPE 1
> > #define CORE_TYPE 2
> > +#define DIE_TYPE 5
>
> This patch set is going to export die topology via sysfs
> while the extended topology sub-leaf type could be one of followings:
> SMT/Core/Module/Tile/Die according to CPUID.1F from SDM.
>
> Why not choose to export module/tile topology as well?

Excellent question. (and thank you for reading the SDM:-)

While it is true that there are shipping products with
software-visible CPU modules and tiles,
they shipped before this mechanism was available. As a result, there
are currently zero
products that use this mechanism to enumerate modules and tiles. If
future products
have software-visible modules and tiles, and they choose to use this mechanism,
we can add support for them. But I do not advocate adding code to the kernel
"just in case".

In contrast, the need to support multi-die/package products as soon as
possible is quite clear.

thanks,
Len Brown, Intel Open Source Technology Center

\
 
 \ /
  Last update: 2019-02-20 07:11    [W:0.060 / U:5.152 seconds]
©2003-2018 Jasper Spaans|hosted at Digital Ocean and TransIP|Read the blog|Advertise on this site