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SubjectRe: [PATCH 00/10] perf: Multi-die/package support
On Tue, Feb 19, 2019 at 12:00:01PM -0800, kan.liang@linux.intel.com wrote:
> From: Kan Liang <kan.liang@linux.intel.com>
>
> Add Linux perf support for multi-die/package. The first product with
> multi-die is Xeon Cascade Lake-AP (CLX-AP).
> The code bases on the top of Len's multi-die/package support.
> https://lkml.org/lkml/2019/2/18/1534

*sigh*, don't use lkml.org links.

We have a perfectly good canonical form:

https://lkml.kernel.org/r/20190219034013.4147-1-lenb@kernel.org

which has the added benefit of including the Message-Id such that I can
easily find the email in my local archive.

And since Len forgot to Cc me on those, I suppose I'll have to go dig
them out to make sense of these here patches.

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