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Subject[PATCH 10/11] thermal/x86_pkg_temp_thermal: Support multi-die/package
Date
From: Zhang Rui <rui.zhang@intel.com>

On the new dual-die/package systems, the package temperature MSR becomes
die-scope. Thus instead of one thermal zone device per physical package,
now there should be one thermal_zone for each die on these systems.

This patch introduces x86_pkg_temp_thermal support for new
dual-die/package systems.

On the hardwares that do not have multi-die, topology_die_id() equals
topology_physical_package_id(), thus there is no functional change.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
---
drivers/thermal/intel/x86_pkg_temp_thermal.c | 9 +++++----
1 file changed, 5 insertions(+), 4 deletions(-)

diff --git a/drivers/thermal/intel/x86_pkg_temp_thermal.c b/drivers/thermal/intel/x86_pkg_temp_thermal.c
index 1ef937d799e4..a2eb9136105e 100644
--- a/drivers/thermal/intel/x86_pkg_temp_thermal.c
+++ b/drivers/thermal/intel/x86_pkg_temp_thermal.c
@@ -122,7 +122,7 @@ static int pkg_temp_debugfs_init(void)
*/
static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
{
- int pkgid = topology_logical_package_id(cpu);
+ int pkgid = topology_unique_die_id(cpu);

if (pkgid >= 0 && pkgid < max_packages)
return packages[pkgid];
@@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)

static int pkg_temp_thermal_device_add(unsigned int cpu)
{
- int pkgid = topology_logical_package_id(cpu);
+ int pkgid = topology_unique_die_id(cpu);
u32 tj_max, eax, ebx, ecx, edx;
struct pkg_device *pkgdev;
int thres_count, err;
@@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
* worker will see the package anymore.
*/
if (lastcpu) {
- packages[topology_logical_package_id(cpu)] = NULL;
+ packages[topology_unique_die_id(cpu)] = NULL;
/* After this point nothing touches the MSR anymore. */
wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
@@ -511,11 +511,12 @@ MODULE_DEVICE_TABLE(x86cpu, pkg_temp_thermal_ids);
static int __init pkg_temp_thermal_init(void)
{
int ret;
+ struct cpuinfo_x86 *c = &cpu_data(0);

if (!x86_match_cpu(pkg_temp_thermal_ids))
return -ENODEV;

- max_packages = topology_max_packages();
+ max_packages = topology_max_packages() * c->x86_max_dies;
packages = kcalloc(max_packages, sizeof(struct pkg_device *),
GFP_KERNEL);
if (!packages)
--
2.18.0-rc0
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