Messages in this thread | | | From | Heiko Stübner <> | Subject | Re: [PATCH v1 1/3] dt-bindings: rockchip-thermal: Support the RK3308 SoC compatible | Date | Tue, 05 Nov 2019 08:58:56 +0100 |
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Am Dienstag, 5. November 2019, 04:17:24 CET schrieb Elaine Zhang: > Add a new compatible for thermal founding on RK3308 SoCs. > > Signed-off-by: Elaine Zhang <zhangqing@rock-chips.com>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
> --- > Documentation/devicetree/bindings/thermal/rockchip-thermal.txt | 1 + > 1 file changed, 1 insertion(+) > > diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt > index c6aac9bcacf1..3a0a9556680e 100644 > --- a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt > +++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt > @@ -6,6 +6,7 @@ Required properties: > "rockchip,rv1108-tsadc": found on RV1108 SoCs > "rockchip,rk3228-tsadc": found on RK3228 SoCs > "rockchip,rk3288-tsadc": found on RK3288 SoCs > + "rockchip,rk3308-tsadc": found on RK3308 SoCs > "rockchip,rk3328-tsadc": found on RK3328 SoCs > "rockchip,rk3368-tsadc": found on RK3368 SoCs > "rockchip,rk3399-tsadc": found on RK3399 SoCs >
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