Messages in this thread | | | Subject | Re: [PATCH 0/2] dt: thermal: Fix broken cooling-maps | From | Wei Xu <> | Date | Wed, 18 Jul 2018 16:34:24 +0100 |
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Hi Viresh,
On 2018/7/5 6:09, Viresh Kumar wrote: > Hi, > > This is an attempt to fix the broken or partially defined DT bindings > for cooling-maps. We should list every device that participates in > cooling down at a certain trip point, instead of just the first in the > list as that depends on certain ordering of events to work properly. > > The first patch extends the binding to allow a list of phandles in > "cooling-device" property and the second patch fixes one of the > platform's DT. > > This will be followed up by fixing all platform DT bindings that have > these issues after this set is accepted. > > The kernel also requires some changes to handle the phandle list, but > wouldn't break with these changes as it reads the first phandle in the > list for now. We can update that separately. > > -- > viresh > > Viresh Kumar (2): > dt-bindings: thermal: Allow multiple devices to share cooling map > arm64: dts: hi6220: Add all CPUs in cooling maps > > Documentation/devicetree/bindings/thermal/thermal.txt | 11 +++-------- > arch/arm64/boot/dts/hisilicon/hi6220.dtsi | 9 ++++++++- > 2 files changed, 11 insertions(+), 9 deletions(-) >
Thanks! Applied both to the hisilicon dt tree.
Best Regards, Wei
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