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SubjectRe: [PATCH 02/25] thermal/drivers/hisi: Remove the multiple sensors support
On 17/10/2017 05:54, Eduardo Valentin wrote:
> On Tue, Oct 10, 2017 at 08:02:27PM +0200, Daniel Lezcano wrote:
>> By essence, the tsensor does not really support multiple sensor at the same
>> time. It allows to set a sensor and use it to get the temperature, another
>> sensor could be switched but with a delay of 3-5ms. It is difficult to read
>> simultaneously several sensors without a big delay.
> Is 3-5 ms enough to loose an event? Is this really a problem?

There are several aspects:

- the multiple sensors is not needed here

- the temperature controller is not designed to read several sensors at
the same time, we switch the sensor and that clears some internal
buffers and re-init the controller

- some boards can take 40°C in 1 sec, the temperature increase is
insanely fast and reading several sensors add an extra 15ms.

So from my point of view, trying to read multiple sensors with *this*
tsensor is pointless.

>> Today, just one sensor is used, it is not necessary to deal with multiple
> How come? Today the driver exposes all sensors to userspace. Removing
> them, means you are changing the amount of sensors userspace really
> sees.
> Are you sure about this?
> Can you please elaborate how we are only using one of the four sensors?

Only one has been defined in the DT since the beginning and no one is
using multiple sensors.

>> sensors in the code. Remove them and if it is needed in the future add them
>> on top of a code which will be clean up in the meantime.
> It is just not clear to me why having 1 sensor support is better than
> having 4, as per the hw supported tsensor.

The tsensor supports 4 sensors but not at the same time. You choose one
and use it, AFAICS from the documentation and behavior.

If multiple sensors is needed later, I will be happy to re-introduce it
on top of a sanitized driver.

>> Signed-off-by: Daniel Lezcano <>
> I would prefer to get confirmation from folks from hisilicon here.
> BTW, you should be copying previous author of the code.

Hmm, I thought Leo was in copy (added). Kevin is from hisilicon and in
charge of the thermal aspect of the hikey.

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