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SubjectRe: [PATCH] thermal: Bind cooling devices with the correct arguments
On 06/17/14 03:20, Punit Agrawal wrote:
> Ping?
>
> Punit Agrawal <punit.agrawal@arm.com> writes:
>
>> When binding cooling devices to thermal zones created from the device
>> tree the minimum and maximum cooling states are in the wrong order
>> leading to failure to bind.
>>
>> Fix the order of cooling states in the call to
>> thermal_zone_bind_cooling_device to fix this.
>>
>> Cc:Zhang Rui <rui.zhang@intel.com>
>> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>

Ah I ran into the same problem while testing out some thermal DT stuff.

Reviewed-by: Stephen Boyd <sboyd@codeaurora.org>

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