Messages in this thread | | | Subject | Re: [RFC PATCH v2 3/3] usb: dwc3: Add Qualcomm DWC3 glue layer driver | From | "Ivan T. Ivanov" <> | Date | Fri, 09 Aug 2013 11:16:40 -0400 |
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Hi,
On Fri, 2013-08-09 at 16:32 +0300, Felipe Balbi wrote: > On Fri, Aug 09, 2013 at 12:53:47PM +0300, Ivan T. Ivanov wrote: > > From: "Ivan T. Ivanov" <iivanov@mm-sol.com> > > > > DWC3 glue layer is hardware layer around Synopsys DesignWare > > USB3 core. Its purpose is to supply Synopsys IP with required > > clocks, voltages and interface it with the rest of the SoC. > > > > Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com> > > same comments from previous version. >
Sorry, I have somehow missed Your email. I will address them shortly.
Regard, Ivan
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