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SubjectRe: [RFC 2/2] usb: dwc3: Add Qualcomm DWC3 glue layer driver
On Tue, Aug 06, 2013 at 12:53:11PM +0100, Ivan T. Ivanov wrote:
> From: "Ivan T. Ivanov" <iivanov@mm-sol.com>

What does the "glue layer" do? Is it an actual piece of hardware, or
just some platform-specific code?

>
> Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
> ---
> .../devicetree/bindings/usb/msm-ssusb.txt | 39 +++++
> drivers/usb/dwc3/Kconfig | 8 +
> drivers/usb/dwc3/Makefile | 1 +
> drivers/usb/dwc3/dwc3-msm.c | 175 ++++++++++++++++++++
> 4 files changed, 223 insertions(+)
> create mode 100644 drivers/usb/dwc3/dwc3-msm.c
>
> diff --git a/Documentation/devicetree/bindings/usb/msm-ssusb.txt b/Documentation/devicetree/bindings/usb/msm-ssusb.txt
> index 550b496..313ae0d 100644
> --- a/Documentation/devicetree/bindings/usb/msm-ssusb.txt
> +++ b/Documentation/devicetree/bindings/usb/msm-ssusb.txt
> @@ -22,6 +22,23 @@ Required "supply-name" examples are:
> "v1p8" : 1.8v supply for SS-PHY
> "vddcx" : vdd supply for SS-PHY digital circuit operation
>
> +Required properties :
> +- compatible : should be "qcom,dwc-usb3-msm"
> +- reg : offset and length of the register set in the memory map
> + offset and length of the TCSR register for routing USB
> + signals to either picoPHY0 or picoPHY1.
> +- clocks = <&usb30_master_cxc>, <&sys_noc_usb3_axi_cxc>, <&usb30_sleep_cxc>, <&usb30_mock_utmi_cxc>;

Similarly to my comment on patch 1, these need to be described better.

Thanks,
Mark.


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