Messages in this thread | | | Date | Sun, 4 Mar 2012 21:21:57 -0800 (PST) | Subject | Re: [PATCH v5 2/2] mmc: core: Support packed command for eMMC4.5 device | From | merez@codeauro ... |
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> Hi Merez > > On 2 March 2012 19:56, <merez@codeaurora.org> wrote: >> Hi, >> >> Our tests showed that the write packing improved the performance of the >> write sequential operations: >> >> Long write operation: >> ---------------------- >> no-packing: 15.8 MB/s >> packed commands patch (both READ and WRITE packing are enabled): 23.3 >> MB/s >> >> Several parallel write operations (sum of all the write throughputs): >> --------------------------- >> no-packing: 17.1 MB/s >> packed commands patch(both READ and WRITE packing are enabled): 25 MB/s >> >> Parallel long read and long write operations (write throughput): >> ----------------------------------------------------------------- >> no-packing: 12.2 MB/s >> packed commands patch (both READ and WRITE packing are enabled): 16.3 >> MB/s >> >> Parallel short read and long write operations (write throughput): >> ----------------------------------------------------------------- >> no-packing: 15.4 MB/s >> packed commands patch (both READ and WRITE packing are enabled): 16.4 >> MB/s >> >> Several Parallel short read and short write operations (sum of all the >> write throughputs): >> -------------------------------------------------------------------------- >> no-packing: 12.5 MB/s >> packed commands patch (both READ and WRITE packing are enabled): 15.5 >> MB/s >> > > How did you perform the above tests ? The sequential tests were performed with the lmdd application. Thanks, Maya Erez Consultant for Qualcomm Innovation Center, Inc. Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum
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