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    SubjectRe: [RFC PATCH 0/2] thermal: Add generic cpu cooling devices according to thermal framework
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    Hi, sorry for the late response.

    On 四, 2012-01-19 at 14:47 +0530, Amit Kachhap wrote:
    > On 13 December 2011 20:43, Amit Daniel Kachhap <amit.kachhap@linaro.org> wrote:
    > > PATCH 1) [thermal: Add a new trip type to use cooling device instance number]
    > > This patch adds a new trip type THERMAL_TRIP_STATE_ACTIVE which passes
    > > cooling device instance number and may be helpful for cpufreq cooling devices
    > > to take the correct cooling action.
    > >
    Sorry, I'm still not quite clear about how this will be used.
    Say, processor has P0~P3, then we need to register a thermal zone with
    three STATE_ACTIVE trip points, like the picture shown below?

    processor in full speed, i.e. P0
    ----------------------------
    state active trip point 1
    ----------------------------
    processor in P1
    ----------------------------
    state active trip point 2
    ----------------------------
    processor in P2
    ----------------------------
    state active trip point 3
    ----------------------------
    processor in P3

    > > PATCH 2) [thermal: Add generic cpu cooling implementation]
    > > This patch adds generic cpu cooling low level implementation through frequency
    > > clipping and cpu hotplug. In future, other cpu related cooling devices may be
    > > added here. An ACPI version of this already exists(drivers/acpi/processor_thermal.c).
    > > But this will be useful for platforms like ARM using the generic thermal interface
    > > along with the generic cpu cooling devices. The cooling device registration API's
    > > return cooling device pointers which can be easily binded with the thermal zone
    > > trip points.
    > >
    It seems that we can convert the ACPI processor thermal driver to follow
    this generic cpu cooling implementation, right?

    thanks,
    rui
    >
    > Any comments on these patches? I submitted them quite long back.
    >
    > Regards,
    > Amit D
    >
    > >
    > > Amit Daniel Kachhap (2):
    > > thermal: Add a new trip type to use cooling device instance number
    > > thermal: Add generic cpu cooling implementation
    > >
    > > Documentation/thermal/cpu-cooling-api.txt | 52 +++++
    > > Documentation/thermal/sysfs-api.txt | 4 +-
    > > drivers/thermal/Kconfig | 11 +
    > > drivers/thermal/Makefile | 1 +
    > > drivers/thermal/cpu_cooling.c | 302 +++++++++++++++++++++++++++++
    > > drivers/thermal/thermal_sys.c | 27 +++-
    > > include/linux/cpu_cooling.h | 45 +++++
    > > include/linux/thermal.h | 1 +
    > > 8 files changed, 440 insertions(+), 3 deletions(-)
    > > create mode 100644 Documentation/thermal/cpu-cooling-api.txt
    > > create mode 100644 drivers/thermal/cpu_cooling.c
    > > create mode 100644 include/linux/cpu_cooling.h
    > >


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