Messages in this thread Patch in this message | | | Date | Tue, 30 Jun 2009 16:59:47 -0700 | From | Greg KH <> | Subject | [patch 03/30] bonding: fix multiple module load problem |
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2.6.27-stable review patch. If anyone has any objections, please let us know.
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From: Stephen Hemminger <shemminger@vyatta.com>
[ Upstream commit 130aa61a77b8518f1ea618e1b7d214d60b405f10 ]
Some users still load bond module multiple times to create bonding devices. This accidentally was broken by a later patch about the time sysfs was fixed. According to Jay, it was broken by: commit b8a9787eddb0e4665f31dd1d64584732b2b5d051 Author: Jay Vosburgh <fubar@us.ibm.com> Date: Fri Jun 13 18:12:04 2008 -0700
bonding: Allow setting max_bonds to zero
Note: sysfs and procfs still produce WARN() messages when this is done so the sysfs method is the recommended API.
Signed-off-by: Stephen Hemminger <shemminger@vyatta.com> Signed-off-by: Jay Vosburgh <fubar@us.ibm.com> Signed-off-by: David S. Miller <davem@davemloft.net> Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
--- drivers/net/bonding/bond_sysfs.c | 1 + 1 file changed, 1 insertion(+)
--- a/drivers/net/bonding/bond_sysfs.c +++ b/drivers/net/bonding/bond_sysfs.c @@ -1464,6 +1464,7 @@ int bond_create_sysfs(void) printk(KERN_ERR "network device named %s already exists in sysfs", class_attr_bonding_masters.attr.name); + ret = 0; } return ret;
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