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    SubjectRe: SMP/cc Cluster description [was Linux/Pro]
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    > So either way, you wind up with SMP on one die.  (You can't make chips TOO 
    > much smaller because it becomes less economical to cut the wafer up that
    > small. Harvesting and connecting the chips at finer granularity increases

    Except for VIA (where they cant really make them much smaller) the
    mainstream x86 dies are _gigantic_

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