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SubjectRe: [PATCH v1 1/5] dt-bindings: soc: qcom: Add memory_dump driver bindings
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On 2023/10/23 20:52, Krzysztof Kozlowski wrote:
> On 23/10/2023 13:54, Zhenhua Huang wrote:
>>
>>
>> On 2023/10/23 17:27, Krzysztof Kozlowski wrote:
>>> On 23/10/2023 11:20, Zhenhua Huang wrote:
>>>> Add bindings for the QCOM Memory Dump driver providing debug
>>>
>>> Bindings are for hardware, not driver. This suggests it is not suitable
>>> for bindings at all.
>>>
>>>> facilities. Firmware dumps system cache, internal memory,
>>>> peripheral registers to reserved DDR as per the table which
>>>> populated by the driver, after crash and warm reset.
>>>
>>> Again driver :/
>>
>> Thanks for pointing out. Qualcomm memory dump device is a reserved
>> memory region which is used to communicate with firmware. I will update
>> description in next version.
>
> I have still doubts that it is suitable for DT. I usually expect such
> firmware feature-drivers to be instantiated by existing firmware
> drivers. You do not need DT for this.

Got it, as it interacts with firmware, you think it should be a firmware
driver? But it seems there should not be existing suitable place to put
it now(qcom_scm.c is for TZ). Shall we create one new file like
*qcom_sdi.c* in drivers/firmware and put it there? Because SDI(system
debug image, which is part of bootloader) is the firmware doing the things.

>
> Best regards,
> Krzysztof
>

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