Messages in this thread | | | Date | Tue, 24 Oct 2023 18:57:04 +0800 | Subject | Re: [PATCH v1 1/5] dt-bindings: soc: qcom: Add memory_dump driver bindings | From | Zhenhua Huang <> |
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On 2023/10/23 20:52, Krzysztof Kozlowski wrote: > On 23/10/2023 13:54, Zhenhua Huang wrote: >> >> >> On 2023/10/23 17:27, Krzysztof Kozlowski wrote: >>> On 23/10/2023 11:20, Zhenhua Huang wrote: >>>> Add bindings for the QCOM Memory Dump driver providing debug >>> >>> Bindings are for hardware, not driver. This suggests it is not suitable >>> for bindings at all. >>> >>>> facilities. Firmware dumps system cache, internal memory, >>>> peripheral registers to reserved DDR as per the table which >>>> populated by the driver, after crash and warm reset. >>> >>> Again driver :/ >> >> Thanks for pointing out. Qualcomm memory dump device is a reserved >> memory region which is used to communicate with firmware. I will update >> description in next version. > > I have still doubts that it is suitable for DT. I usually expect such > firmware feature-drivers to be instantiated by existing firmware > drivers. You do not need DT for this.
Got it, as it interacts with firmware, you think it should be a firmware driver? But it seems there should not be existing suitable place to put it now(qcom_scm.c is for TZ). Shall we create one new file like *qcom_sdi.c* in drivers/firmware and put it there? Because SDI(system debug image, which is part of bootloader) is the firmware doing the things.
> > Best regards, > Krzysztof >
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