| Date | Tue, 17 Oct 2023 08:05:00 +0200 | Subject | Re: [PATCH 09/12] dt-bindings: usb: qcom,dwc3: Rename to "glue" | From | Krzysztof Kozlowski <> |
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On 17/10/2023 05:11, Bjorn Andersson wrote: > The Qualcomm USB block consists of three intertwined parts, the XHCI, > the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents > the Qualcomm glue part, with the other two represented as in a child > node. > > Rename the qcom,dwc3 binding, to represent that this is indeed only the > glue part, to make room for a combined binding. > > The large "select" is included to avoid the schema to be selected for > validation with the upcoming flattened binding - which includes > snps,dwc3 in the compatible. > > Signed-off-by: Bjorn Andersson <quic_bjorande@quicinc.com> > ---
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Best regards, Krzysztof
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