Messages in this thread | | | From | "Alice Guo (OSS)" <> | Subject | RE: [PATCH v1 1/2] thermal: Add generic device cooling support | Date | Thu, 5 Jan 2023 10:07:23 +0000 |
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Hi,
I did not reply in time. Sorry to bother you. Please ignore this patchset.
Best Regards, Alice Guo
> -----Original Message----- > From: Daniel Lezcano <daniel.lezcano@linaro.org> > Sent: Thursday, January 5, 2023 5:59 PM > To: Alice Guo (OSS) <alice.guo@oss.nxp.com>; rafael@kernel.org; > amitk@kernel.org; rui.zhang@intel.com; Aisheng Dong > <aisheng.dong@nxp.com>; shawnguo@kernel.org; Leo Li > <leoyang.li@nxp.com> > Cc: linux-arm-kernel@lists.infradead.org; linux-pm@vger.kernel.org; > linux-kernel@vger.kernel.org > Subject: Re: [PATCH v1 1/2] thermal: Add generic device cooling support > > On 05/01/2023 09:22, Alice Guo (OSS) wrote: > > From: Anson Huang <Anson.Huang@nxp.com> > > > > To compatible with previous implementation, add generic device cooling > > support, each thermal zone will register a cooling device, and when > > temperature exceed passive trip, the device cooling driver will send > > out a system wide notification, each device supporting cooling will > > need to register device cooling and takes action when passive trip is > > exceeded; > > Can you explain the use case you want to solve with this solution and the > limitations of the existing ones ? > > > -- > <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs > > Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook | > <http://twitter.com/#!/linaroorg> Twitter | > <http://www.linaro.org/linaro-blog/> Blog
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