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Subject[PATCH v2 12/14] thermal: exynos: remove separate exynos_tmu.h header file
Date
exynos_tmu.h is used only by exynos_tmu.c so there is no need
for a separate include file.

Also while at it remove no longer needed cpu_cooling.h include.

There should be no functional changes caused by this patch.

Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
---
Replacement patch for v1.

v2:
- Remove cpu_cooling.h include (as requested by Daniel)
- Add Acked-by from Daniel

drivers/thermal/samsung/exynos_tmu.c | 17 +++++++++++++-
drivers/thermal/samsung/exynos_tmu.h | 41 -----------------------------------
2 files changed, 16 insertions(+), 42 deletions(-)

Index: b/drivers/thermal/samsung/exynos_tmu.c
===================================================================
--- a/drivers/thermal/samsung/exynos_tmu.c 2018-04-16 16:13:18.995562674 +0200
+++ b/drivers/thermal/samsung/exynos_tmu.c 2018-04-16 16:13:28.663562918 +0200
@@ -35,7 +35,8 @@
#include <linux/platform_device.h>
#include <linux/regulator/consumer.h>

-#include "exynos_tmu.h"
+#include <dt-bindings/thermal/thermal_exynos.h>
+
#include "../thermal_core.h"

/* Exynos generic registers */
@@ -173,6 +174,20 @@
#define EXYNOS_NOISE_CANCEL_MODE 4

#define MCELSIUS 1000
+
+enum soc_type {
+ SOC_ARCH_EXYNOS3250 = 1,
+ SOC_ARCH_EXYNOS4210,
+ SOC_ARCH_EXYNOS4412,
+ SOC_ARCH_EXYNOS5250,
+ SOC_ARCH_EXYNOS5260,
+ SOC_ARCH_EXYNOS5420,
+ SOC_ARCH_EXYNOS5420_TRIMINFO,
+ SOC_ARCH_EXYNOS5433,
+ SOC_ARCH_EXYNOS5440,
+ SOC_ARCH_EXYNOS7,
+};
+
/**
* struct exynos_tmu_data : A structure to hold the private data of the TMU
driver
Index: b/drivers/thermal/samsung/exynos_tmu.h
===================================================================
--- a/drivers/thermal/samsung/exynos_tmu.h 2018-04-16 16:13:18.995562674 +0200
+++ /dev/null 1970-01-01 00:00:00.000000000 +0000
@@ -1,41 +0,0 @@
-/*
- * exynos_tmu.h - Samsung EXYNOS TMU (Thermal Management Unit)
- *
- * Copyright (C) 2011 Samsung Electronics
- * Donggeun Kim <dg77.kim@samsung.com>
- * Amit Daniel Kachhap <amit.daniel@samsung.com>
- *
- * This program is free software; you can redistribute it and/or modify
- * it under the terms of the GNU General Public License as published by
- * the Free Software Foundation; either version 2 of the License, or
- * (at your option) any later version.
- *
- * This program is distributed in the hope that it will be useful,
- * but WITHOUT ANY WARRANTY; without even the implied warranty of
- * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
- * GNU General Public License for more details.
- *
- * You should have received a copy of the GNU General Public License
- * along with this program; if not, write to the Free Software
- * Foundation, Inc., 59 Temple Place, Suite 330, Boston, MA 02111-1307 USA
- */
-
-#ifndef _EXYNOS_TMU_H
-#define _EXYNOS_TMU_H
-#include <linux/cpu_cooling.h>
-#include <dt-bindings/thermal/thermal_exynos.h>
-
-enum soc_type {
- SOC_ARCH_EXYNOS3250 = 1,
- SOC_ARCH_EXYNOS4210,
- SOC_ARCH_EXYNOS4412,
- SOC_ARCH_EXYNOS5250,
- SOC_ARCH_EXYNOS5260,
- SOC_ARCH_EXYNOS5420,
- SOC_ARCH_EXYNOS5420_TRIMINFO,
- SOC_ARCH_EXYNOS5433,
- SOC_ARCH_EXYNOS5440,
- SOC_ARCH_EXYNOS7,
-};
-
-#endif /* _EXYNOS_TMU_H */
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