lkml.org 
[lkml]   [2018]   [Feb]   [7]   [last100]   RSS Feed
Views: [wrap][no wrap]   [headers]  [forward] 
 
Messages in this thread
/
SubjectRe: [PATCH 8/8] thermal/drivers/cpu_cooling: Add the combo cpu cooling device
From
Date
On 07/02/2018 08:26, Viresh Kumar wrote:
> On 06-02-18, 11:48, Daniel Lezcano wrote:
>> On 06/02/2018 05:28, Viresh Kumar wrote:
>
>>> Surely we can do one thing at a time if that's the way we choose to do it.
>>
>> Easy to say :)
>>
>> The current code is to introduce the feature without impacting the DT
>> bindings in order to keep focused on the thermal mitigation aspect.
>>
>> There are still a lot of improvements to do after that. You are
>> basically asking me to implement the copy-on-write before the memory
>> management is complete.
>
> Perhaps I wasn't clear. What I was trying to say is that we can do "one thing at
> a time" if we choose to create a "combo device" (the way you proposed). I am not
> trying to force you to solve all the problems in one go :)

Oh, ok :)

>> Can you give an example? Or your understanding is incorrect or I missed
>> the point.
>
> So I tried to write it down and realized I was assuming that different
> cooling-maps can be provided for different cooling strategies
> (cpufreq/cpuidle) and obviously that's not the case as its per device.
> Not sure if it would be correct to explore the possibility of doing
> that.
>


--
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog

\
 
 \ /
  Last update: 2018-02-07 11:06    [W:0.057 / U:3.296 seconds]
©2003-2018 Jasper Spaans|hosted at Digital Ocean and TransIP|Read the blog|Advertise on this site