Messages in this thread | | | Date | Wed, 5 Jul 2017 17:50:53 +0200 | From | Peter Zijlstra <> | Subject | Re: [PATCH 1/2] x86/CPU/AMD: Present package as die instead of socket |
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On Tue, Jun 27, 2017 at 08:07:10PM +0700, Suravee Suthikulpanit wrote:
> As I have described in the cover letter, this patch series changes how
Which you didn't send to me... thanks for that.
> kernel derives cpu "package" from package-as-socket to package-as-die in > order to fix following issues on AMD family17h multi-die processor > platforms:
> These issues are fixed when properly intepretes package as DIE. > > For MCM Magny-Cours (family15h), we do not have this issue because the MC > sched-domain has the same cpumask as the DIE sched-domain. This is not the > same as for Zen cores (family17h) where the MC sched-domain is the CCX (2 > CCX per die)
Are you saying that your LLCs are smaller than your NUMA nodes ? You do not in fact have a cache level that spans the memory controller?
Because that is indeed the assumption we have for Intel CoD/SnC and AMD Magny-Cours.
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