Messages in this thread | | | Subject | Re: [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor bindings | From | Wei Xu <> | Date | Tue, 20 Jun 2017 11:27:43 +0100 |
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Hi Tao,
On 2017/6/20 4:40, Tao Wang wrote: > This adds documentation of device tree bindings for the > thermal sensor controller of hi3660 SoC. > > Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com> > --- > .../devicetree/bindings/thermal/hi3660-thermal.txt | 17 +++++++++++++++++ > 1 file changed, 17 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt > > diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt > new file mode 100644 > index 0000000..c034670 > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt > @@ -0,0 +1,17 @@ > +* Temperature Sensor on hisilicon hi3660 SoC > + > +** Required properties : > + > +- compatible: "hisilicon,thermal-hi3660".
It is better to put the SoC name before the function string.
BR, Wei
> +- reg: physical base address of thermal sensor and length of memory mapped > + region. > +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. > + > +Example : > + > + tsensor: tsensor { > + compatible = "hisilicon,thermal-hi3660"; > + reg = <0x0 0xfff30000 0x0 0x1000>; > + #thermal-sensor-cells = <1>; > + status = "ok"; > + }; >
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