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    SubjectRe: [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor bindings
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    Hi Tao,

    On 2017/6/20 4:40, Tao Wang wrote:
    > This adds documentation of device tree bindings for the
    > thermal sensor controller of hi3660 SoC.
    >
    > Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
    > ---
    > .../devicetree/bindings/thermal/hi3660-thermal.txt | 17 +++++++++++++++++
    > 1 file changed, 17 insertions(+)
    > create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
    >
    > diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
    > new file mode 100644
    > index 0000000..c034670
    > --- /dev/null
    > +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
    > @@ -0,0 +1,17 @@
    > +* Temperature Sensor on hisilicon hi3660 SoC
    > +
    > +** Required properties :
    > +
    > +- compatible: "hisilicon,thermal-hi3660".

    It is better to put the SoC name before the function string.

    BR,
    Wei

    > +- reg: physical base address of thermal sensor and length of memory mapped
    > + region.
    > +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
    > +
    > +Example :
    > +
    > + tsensor: tsensor {
    > + compatible = "hisilicon,thermal-hi3660";
    > + reg = <0x0 0xfff30000 0x0 0x1000>;
    > + #thermal-sensor-cells = <1>;
    > + status = "ok";
    > + };
    >

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