Messages in this thread Patch in this message | | | From | Tao Wang <> | Subject | [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor bindings | Date | Tue, 20 Jun 2017 11:40:33 +0800 |
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This adds documentation of device tree bindings for the thermal sensor controller of hi3660 SoC.
Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com> --- .../devicetree/bindings/thermal/hi3660-thermal.txt | 17 +++++++++++++++++ 1 file changed, 17 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt new file mode 100644 index 0000000..c034670 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt @@ -0,0 +1,17 @@ +* Temperature Sensor on hisilicon hi3660 SoC + +** Required properties : + +- compatible: "hisilicon,thermal-hi3660". +- reg: physical base address of thermal sensor and length of memory mapped + region. +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. + +Example : + + tsensor: tsensor { + compatible = "hisilicon,thermal-hi3660"; + reg = <0x0 0xfff30000 0x0 0x1000>; + #thermal-sensor-cells = <1>; + status = "ok"; + }; -- 1.7.9.5
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