Messages in this thread | | | Date | Thu, 11 Jun 2009 05:44:41 -0700 (PDT) | Subject | Re: [PATCH] bonding: fix multiple module load problem | From | David Miller <> |
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From: Stephen Hemminger <shemminger@vyatta.com> Date: Tue, 9 Jun 2009 23:07:54 -0700
> Some users still load bond module multiple times to create bonding > devices. This accidentally was broken by a later patch about > the time sysfs was fixed. According to Jay, it was broken > by: > commit b8a9787eddb0e4665f31dd1d64584732b2b5d051 > Author: Jay Vosburgh <fubar@us.ibm.com> > Date: Fri Jun 13 18:12:04 2008 -0700 > > bonding: Allow setting max_bonds to zero > > Note: sysfs and procfs still produce WARN() messages when this is done > so the sysfs method is the recommended API. > > Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>
Applied, and queued up for -stable, thanks!
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