Messages in this thread | | | Subject | Re: SMP/cc Cluster description [was Linux/Pro] | Date | Thu, 6 Dec 2001 00:34:23 +0000 (GMT) | From | Alan Cox <> |
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> So either way, you wind up with SMP on one die. (You can't make chips TOO > much smaller because it becomes less economical to cut the wafer up that > small. Harvesting and connecting the chips at finer granularity increases
Except for VIA (where they cant really make them much smaller) the mainstream x86 dies are _gigantic_
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